"Nanoelectronics is the future. Once we have reliable packages at the nanoscale we can do many, many things."
Cemal Basaran was pursuing a structural engineering degree in earthquake engineering when he followed a faculty mentor into the engineering problems of structures as small and apparently simple as a microscopic drop of solder. Now, as director of UB's Electronics Packaging Laboratory, he and his colleagues are addressing critical circuit board-level problems confronting the electronics industry as the industry seeks to make packages smaller and more reliable. Intel is using the lab's research in developing next-generation packaging for its Pentium processor.
The lab also is working on development of reliable packages for the bio environment, as well as nanoscale packages that may lead to the creation of supercomputers as small as a wristwatch.
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Cemal Basaran