Researchers in CSEE's Electronics Packaging Laboratory use laser Moire interferometry to measure submicron-scale deformation in solder joints that have been subjected to both elevated temperature and vibration. The lab is a world leader in creating damage mechanics models for electronics.
THE FACES OF CSEE
Christina Tsai Asst. Professor
Environmental Engineering
PROSPECTIVE GRAD STUDENTS
Apply online to any of UB's Civil Structual and Environmental Engineering Graduate programs.
212 Ketter Hall • Buffalo, New York 14260 • Phone: 716-645-2114 ext. 2400 • Fax: 716-645-3733
